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Epoxy silver conductive glue GT 12097                             MS composite gaskets







 GT 12097 is a two-component silver-filled epoxy,
 Properties  GT 12097
 specially designed for flip chip bonding when low-  MS Composite Gasket is an EMI/RFI material composed of a fabric of
 Number of components  2   temperature curing is required.   aluminum wires, impregnated with a silicone or neoprene elastomer of
 Specific gravity  Part A : 2.03 | Part B : 3.07     50 shore hardness.
 Consistency  Smooth, thixotropic paste  GT 12097 is also recommended for applications
 requiring high-temperature curing: at 105°C, GT 12097
 Viscosity (at 100 RPM/23°C)  2.200 - 3.200 cPs
 cures in 5 min instead of 30 min as is required for many   Use
 Hardness Shore D   75
 single-component products.   •  The seals made from these materials ensure an electrical connection
 Lap shear strength at 23°C   1.475 psi     as well as sealing and good resistance to salt spray.
 Die shear strength at 23°C   > 10 Kg / 3.400 psi  This low-viscosity resin does not contain any solvent.
 Degradation temperature(TGA)   425°C  Experience shows that, cured above 120°C, GT 12097   •  These materials are available in the form of sheets, or gaskets
 Continuous operating temperature  -55°C to +200°C   can withstand temperatures of 300°C to 400°C when   cut from different elastomers and different thicknesses.
             (see table below)
 Intermittent operating temperature  -55°C to +300°C   soldering lead wires.
 Storage module at 23° C   808.700 psi
 Particles size  ≤ 45 Microns
 Volume resistivity 23°C   ≤ 0.0004 Ohm-cm
 Thermal conductivity (Based on thermal   29 W/m.K
 resistance)  Presentation
 Thermal resistance (Junction to case)  6.7 to 7.0 °C / W  28 gram jar
                  Getelec reference         Thickness               Elastomer            Aluminum wires
                      MS 16                  0.4 mm                 Neoprene                  30

                      MS 20                  0.5 mm                 Neoprene                  24
                      MS 516                 0.4 mm                  Silicone                 30
                      MS 520                 0.5 mm                  Silicone                 24

 Nickel filled epoxy conductive glue GT 4120           Attenuations


                          H field                        100 KHz                        40 – 50 dB

                          E field                        10 MHz                          100 dB
                        Plane wave                       1 GHz                          50 – 60 dB
 GT 4120 is a two-component, nickel-filled, 100% solids,   Properties  GT 4120
 conductive  epoxy.  It  is designed  for  complementary   Color  Black
 use  and  is  not  a  substitute  for  a  silver-filled  epoxy   Consistency  Slightly thixotropic   Working temperature
 that provides optimum conductivity and performance.   smooth paste
 This nickel epoxy is recommended for circuit repair or   Density g/cm3  3.5  Silicone elastomer  -60°C to +250°C  40 – 50 dB
 coating applications where electrical conductivity is not   Volume resistivity Ω-cm  0.35  Neoprene elastomer  -40°C to +100°C  100 dB
 critical.  Mixture viscosity at 25°C  30000 cps
 Tg at 150°C for one hour  95°C  Presentation
 Hardness shore D  73
 Tensile strength and tear resistance  147.7 kg/cm  Contact us for standard shapes and pre-cut gaskets
 Coefficient of thermal expansion
 (150°C for 1 hour)
 Before Tg  89 x 10-6 mm/mm/°C
 After Tg  139 x 10-6 mm/mm/°C
 Continuous operating temperature  150°C
 Intermittent working temperature  300-400°C
 Degradation temperature  430°C
 Usable life after mixing (at 25°C)  3-4 days
 Usable life before mixing (at 25°C)  1 year







 134
 375 Avenue Morane Saulnier 78530 - Buc, France                                                 www.getelec.com  135
 Tel : +331 39 20 42 42 | info@getelec.com
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