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GT 12097 epoxy silver conductive glues








               Use : GT 12097 is two-component silver-loaded epoxy, specially designed as a chip adhesive for when low temperature
               polymerisation is required. GT12097 is also recommended for applications needing high temperature polymerisation
               : at 105°C, GT12097 polymerises in 5 minutes, unlike the 30 minutes needed by many single component products .
               This low viscosity resin contains no solvents


               Life span : Before mixing, the resin has a life span of 2 years in ambiant conditions; mixed product remains usable
               foR 4 days also at ambiant. Due to its long mixed lifespan and the absence of solvents, GT12097 is ideal for us on
               automated production lines. The combination of a long lifespan when mixed and rapid polymerisation mean that
               GT 12097 is an ideal production optimistion tool.


               Temperature : Experience demonstrates that, polymerised above 120°C, GT12097 withstands soldering
               temperatures of 300°C to 400°C.


                            Properties                     GT 12097
               Number of components             2
               Color of components              Part A : Silver | Part B : Silver
               Mix ratio by wieght              1:1
               Specific gravity                 Part A : 2.03 | Part B : 3.07
               Minimum bond line schedule :
               175 °C                           45 seconds
               150°C                            5 minutes
               120°C                            15 minutes
               100°C                            2 hours
               80°C                             3 hours
               Pot life                         2.5 days
               Shelf life                       1 yeat at 23°C
               Consistency                      Smooth, thixotropic paste                   Presentation
               Viscosity (@ 100 RPM/23°C)       2.200 - 3.200 cPs                            28 gram jar
               Thixotropic Index                4.63
               Coefficient of thermal expansion (CTE) :
               Below Tg                         31x10  in/in/°C
                                                   6
               Above Tg                         158x10  in/in/°C
                                                    -8
               Hardness Shore D                 75
               Lap shear strength at 23°C       1.475 psi
               Die shear strength at  23°C      > 10 Kg / 3.400 psi
               Degradation temp. (TGA)          425°C
               Weight loss
               @ 200°C                          0.59 %
               @ 250°C                          1.09 %
               @ 300°C                          1.67 %
               Operating continuous temperature  -55°C to +200°C
               Operating intermittent temperature  -55°C to +300°C
               Storage modulus at 23° C         808.700 psi
               Particle size                    ≤ 45 Microns
               Volume resistivity at 23°C       ≤ 0.0004 Ohm-cm
               Thermal conductivity             2.5 W/m.K
               (Based on standard method : laser flash)
               Thermal conductivity             29 W/m.K
               (based on thermal resistance )
               Thermal resistance (Junction to case)  6.7 to 7.0 °C / W






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    156    Tel : +33 1 39 20 42 42 | infos@getelec.net
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