Our new range of GTC thermal gap pad has been developed from a specific polymer base perfectly suited to applications requiring no release of silicone-based products (siloxane type).
Our free-silicone thermal pads GTC have equivalent performances to our GTG range. Their significant flexibility ensures that all surface roughness is taken into account during compression and thus ensures optimal operation of your equipment both at low and high temperatures.
The texture of these thermal materials allows for natural adhesion. Adding an adhesive coating is not necessary
|PROPERTIES||GTC 4-25||GTC 4-65||GTC 6-35|
|Hardness (Shore 00)||25 ± 5|
|Density (g/cm3)||3.05 ± 0.5||3.05 ± 0.5||3.23 ± 0.5|
|Break resistance (MPa)||0.1||0.1||0.1|
|Elongation at break (%)||20||20||20|
|Thermal conductivity (W/m.K)||4.2± 0.2||4.2± 0.2||6.3± 0.2|
|Volume resistivity (Ω.cm)||10^10||10^10||10^10|
|Dielectric strength (kV.mm)||15||15||19|
|Working temperature (°C)||-40°C to +100°C (peak at 120°C)||-40°C to +100°C (peak at 120°C)||-40°C to +100°C (peak at 120°C)|
Low thermal resistance
Does not release any silicone-based product
Excellent thermal conductivity
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