The 55th edition of the International Paris Air Show (SIAE) has never been more electrifying. GETELEC, a pioneer in cutting-edge solutions for EMC shielding, thermal dissipation, and microwave absorption, is proud to present five revolutionary innovations that will redefine the standards of performance, flexibility, and efficiency. These new technologies, with commercial deployment planned for late 2025 – early 2026, illustrate our commitment to pushing the boundaries of innovation.
Speed is now the key word. With our new additive manufacturing capability, your ideas become reality in the blink of an eye. GETELEC customers can now create prototypes using 3D printing, drastically reducing costs and lead times. Whether for silicone, filled silicone, or microwave absorbent products, this disruptive technology makes no compromises on material properties.
Your equipment deserves the best. Our new range of electrically conductive thermal pads, the GTG-E, offers breathtaking thermal and electrical conductivity. Designed for the electronics industry, these heat sinks allow devices to achieve maximum performance without adding bulk. It’s a performance upgrade without the clutter.
Already recognized for their exceptional mechanical properties and unrivaled shielding effectiveness, our GT-Flex conductive EMC gaskets are now available in an extruded form. This new shape is perfectly suited for tomorrow’s aerospace challenges. What’s more, the entire range is ESA compliant, ensuring minimal outgassing rate for the most demanding applications. The future of EMC shielding is here, and it’s more flexible and lighter than ever.
